John H. Lau grāmatas
Mechanics of Solder Alloy Interconnects
Harold S. Morgan, Darrel R. Frear, Steven N. Burchett, John H. Lau
-30% ar kodu BOOKS
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Solder Joint Reliability: Theory and Applications
-30% ar kodu BOOKS
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Assembly and Reliability of Lead-Free Solder Joints
-30% ar kodu BOOKS
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Assembly and Reliability of Lead-Free Solder Joints
-30% ar kodu BOOKS
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Chiplet Design and Heterogeneous Integration Packaging
-30% ar kodu BOOKS
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
-30% ar kodu BOOKS
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Chiplet Design and Heterogeneous Integration Packaging
-30% ar kodu BOOKS
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Solder Joint Reliability: Theory and Applications
-30% ar kodu BOOKS
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Chip on Board: Technology for Multichip Modules
-30% ar kodu BOOKS
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
-30% ar kodu BOOKS
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Through-Silicon Vias for 3D Integration
-30% ar kodu BOOKS
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