David A. Dornfeld grāmatas
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Jianfeng Luo, David A. Dornfeld
-30% ar kodu BOOKS
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Precision Manufacturing
Dae-Eun Lee, David A. Dornfeld
-30% ar kodu BOOKS
Piegādātāja noliktavā
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Jianfeng Luo, David A. Dornfeld
-30% ar kodu BOOKS
Piegādātāja noliktavā