Wireless Interface Technologies for 3D IC and Module Integration - Tadahiro Kuroda,Wai-Yeung Yip
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Piegāde 17-23 darba dienu laikā
30 dienu atgriešanas politika
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the desig ... Pilns apraksts
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Aprašymas
Vairāk informācijas
| Autors | Tadahiro Kuroda, Wai-Yeung Yip |
|---|---|
| Izdevējs | Cambridge University Press |
| Izlaides gads | 2021 |
| Vāka tips | Cietais vāks |
| EAN | 9781108841214 |