RF and Microwave Microelectronics Packaging -
-30% ar kodu BOOKS
Piegāde 12-18 darba dienu laikā
30 dienu atgriešanas politika
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechani ... Pilns apraksts
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Aprašymas
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Vairāk informācijas
| Izdevējs | Springer New York |
|---|---|
| Izlaides gads | 2014 |
| Vāka tips | Mīkstais vāks |
| EAN | 9781489983244 |