Materials for Advanced Packaging - Daniel Lu,C.P. Wong
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30 dienu atgriešanas politika
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established te ... Pilns apraksts
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Aprašymas
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Vairāk informācijas
| Autors | Daniel Lu, C.P. Wong |
|---|---|
| Izdevējs | Springer US |
| Izlaides gads | 2008 |
| Vāka tips | Cietais vāks |
| EAN | 9780387782188 |