Area Array Packaging Processes - Ken Gilleo
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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Aprašymas
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
Vairāk informācijas
| Autors | Ken Gilleo |
|---|---|
| Izdevējs | McGraw-Hill Education LLC (Professional Pod) |
| Izlaides gads | 2003 |
| Vāka tips | Mīkstais vāks |
| EAN | 9780071738019 |