Area Array Package Design - Ken Gilleo
-30% ar kodu BOOKS
Piegāde 22-28 darba dienu laikā
30 dienu atgriešanas politika
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Aprašymas
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Vairāk informācijas
| Autors | Ken Gilleo |
|---|---|
| Izdevējs | McGraw-Hill Education LLC (Professional Pod) |
| Izlaides gads | 2003 |
| Vāka tips | Mīkstais vāks |
| EAN | 9780071737739 |