King-Ning Tu grāmatas
Solder Joint Technology: Materials, Properties, and Reliability
-30% ar kodu BOOKS
Piegādātāja noliktavā
Elements of Electromigration: Electromigration in 3D IC technology
-30% ar kodu BOOKS
Piegādātāja noliktavā
Solder Joint Technology: Materials, Properties, and Reliability
-30% ar kodu BOOKS
Piegādātāja noliktavā
Electronic Packaging Science and Technology
Hung-Ming Chen, Chih Chen, King-Ning Tu
-30% ar kodu BOOKS
Piegādātāja noliktavā
Elements of Electromigration: Electromigration in 3D IC technology
-30% ar kodu BOOKS
Piegādātāja noliktavā
Understanding the Reliability Technology Based on Entropy Production, and Other Researches
-30% ar kodu BOOKS
Piegādātāja noliktavā